We will launch our laser scribing production tools for volume manufacturing of high-brightness ODR and DBR LED Sapphire wafers and Silicon wafers. You can find us at Booth W2-2735, and we hope to see you there.
We launched our cassette-automated production tool SolarLase-Pro for backside passivation and MWT applications. SolarLase-Pro can ablate backside passivation materials of 156mm wafers or drill MWT holes at very high rate. It is well-known that backside passivation is a key technology for high-efficiency solar cells, in the meantime, picosecond laser ablation has proven to be the preferred method to open up the passivation layer for backside metal contacts. Laser ablation is a non-contact process, environmentally friendly; it minimizes damage to the underlying silicon substrate when picosecond laser is used. Our production tool SolarLase-Pro is an ideal solution for your laser ablation and MWT volume production needs.